In the semiconductor device manufacturing process, several layers are deposited on the wafer edge. These layers can be deformed or torn during the manufacturing process, resulting in damage in the form of particles on the top of the wafer.

These contaminants can be eliminated by removing unwanted membranes (layers) along the edge. PRECIA is wafer edge cleaning equipment for improving edge yield, providing advantages of low CoO and higher performance.

As plasma, ICP and CCP can be selectively used to exploit the advantages of each. In addition, an N2 Purge Load Port is included to control fumes that can occur after etching, and there are further advantages in dealing with particles thanks to the inclusion of a grip type that minimizes the contact area of wafers during transfer.